Ultra-Precision 3D AOI for Semiconductor Packaging
Magazine Loader/Unloader Built-in Type
Extremely Fast and High-Resolution Laser Line Scan Method
Inspection Irrelevant to Color, Material, Surface Roughness
Perfect Inspection even for Highly Specular Surfaces
Inspection Items
SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.
