Ultra-Precision 2D&3D AOI for Wafer Inspection
High-Resolution Color Image
Easy Teaching, Inspection Result Management
Interworking with EFEM
High Precision
Granite X/Y/Z stage
8”, 12” Ringframe Wafer
: Multi Load Port & Dual arm
Stable
Porous Vacuum Chuck
Inspection Items
Wafer Die(Chipping, Contamination, etc.), Bump(Height, Offset, Coplanarity, etc.)
