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LE CHAMP (South East Asia) Pte Ltd

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X-Ray

X-ray detection of defects such as solder void, micro-cracks, plated through hole filling, wire bond defects, die adhesion counterfeit and more.

  • 2D
  • CT
  • In-Line

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Subsidiary of

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Le Champ

sales@lechamp.com.sg

(65) 6272 8877