- Flexible solutions for standard- or irregular shaped components
- Repeatable solder results due to defined process parameters such as solder temperature, process time, solder well height, ramp up and ramp down
- Easy height adjustment of the printed circuit board over the flow well
- Stable construction: Easy to use and stable table top machine.
- Increase of efficiency due to quick positioning with the air nozzle, simultaneous fusing and soldering of all connections, reliable blowing out of the holes from above, right after removing the component.
- Also irregular shaped circuit boards up to a size of 600 x 600 mm can be fixed on the quick locking board holder.
- Blow out option to clean the solder joints after removal of a connector
- Application specific tooling for any kind of component also on dense populated boards, including multi soldering solutions, for wetting of defined positions
- Optional preheater module PH 4, especially for lead-free applications
- Lead-free retrofit: Already installed machines can be retrofitted for lead-free applications
Repeatable results
Repeatable solder results with the SSM 4A due to defined process parameters such as solder temperature, process time, solder well height, ramp up and ramp down.
Application range
Repairs
Damaged components can be replaced
Prototyping
Prototypes can be equipped and soldered with the SSM machines
Post-assembly
THT Components that are missing at assembly time can be placed and soldered later, or individual THT components which cannot be handled by the available production machines can be retrofitted with the SSM 4A.
Soldering
If only a few components need to be placed on a circuit board, a SSM soldering- and desoldering machine often is the easiest and most economical way.
Efficiency
The ergonomic design allows to work fast and easy and guarantee highest precision results.
- Work with multilayer circuit boards
- Processing of components with complicated geometries as switcher blocks and long connector strips
- Work with boards which are fitted with mixed components
- Soldering at the component side also between high, adjoining components
- Soldering and desoldering von pin grid arrays and bases
- Soldering on flex circuit boards
Optional preheater module PH 4
To improve the performance for lead-free applications
The preheater module PH 4 can be used as individual device or together with the SSM 4A or the SSM 9. Due to preheating of the printed circuit board before the soldering process, the risk of delamination of the copper can be reduced. The preheater PH 4 uses IR technology to preheat the printed circuit board on an area of 300 x 300 mm with a performance of 3500 watt.