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LE CHAMP (South East Asia) Pte Ltd

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Sigma X, 3D In-line SPI

Ultra high speed 3D SPI by Laser Scan Technology

3D SPI

3D SPI

Laser Line Scan Method

Fastest Inspection Speed
in the Industry

Real 3D Image

Inspection Irrelevant to Color, Material, Surface Roughness

Automated Measurement
of PCB Warpage

Automated Compensation of PCB Stretch and Shrinkage

Process Optimization with Feedback & Feedforward Linkage Support

Inspection Items

Height, Area, Volume, Offset, Bridge, Shape, PCB Warpage, PCB Shrink, etc.

Brand

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Subsidiary of

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Le Champ

sales@lechamp.com.sg

(65) 6272 8877