- Inspection with a maximum height of 50㎜
- MIRTEC’s unique Hybrid 3D Technology
- Inspection using Z-axis movement of the optical system
- High precision with a maximum height measurement criterion of ±15㎛ (50,000㎛)
- Press-fit pin, single pin, pin array, fork pin, connector pin inspection
- Inspection possible for THT, SMD components, and pin components
- Side-Viewer® : simultaneous inspection on five sides using an 18-megapixel side cameras
- Intellisys® : Integrated process management system realizing increased productivity and smart factory
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