Automatic Stencil Inspetction machne

In the SMT production process, the defect caused by solder paste printing accounts for more than 70% of the overall defect rate while the defect caused by stencil problems accounts for a high proportion (>50%).

Automatic Stencil Inspection machine ensures stencil quality control through

• Maintaining within specification of aperture area, position, shift, size,
• Eliminating foreign materials, glitch, blocked aperture,
• Ensuring stencil tension within specification
• Verification of width-to-thickness ratio, area ratio, pitch of holes,
• Simulating amount of solder paste