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LE CHAMP (South East Asia) Pte Ltd

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Xceed BSI 3D AOI for Bottom Side Inspection

3D AOI for Bottom Side Inspection

3D AOI for
Bottom Side Inspection

Laser Line Scan Method

Fastest Inspection Speed
in the Industry

Immediate Inspection
Without Flipping Process

Specialized in THD Pin, Wave or Selective Soldering, SMD Inspection

Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time

Inspection Items

THD Pin, Wave or Selective Soldering, SMD, etc.

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Subsidiary of

Follow us on LinkedIn

Le Champ

sales@lechamp.com.sg

(65) 6272 8877