- The world’s best performance 3D SPI
- Super high resolution CXP camera and precision 6㎛ lens
- Solder paste inspection up to 0201(㎜) size component pad
- 30㎛ height solder paste inspection
- Shadow-free dual projection 3D measurement
- High accuracy and repeatability with linear motor drive system
- Auto PCB warpage compensation
- Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
- Intellisys® : Total process management system for improving productivity and achieving smart factory
- High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED
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