- Outstanding performance
- Super high resolution CXP camera and precision 6㎛ lens
- Solder paste inspection up to 0201(㎜) size component pad
- High accuracy & repeatability
- Shadow-free dual projection 3D measurement
- Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel
- Auto PCB warpage compensation
- Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
- Intellisys® : Total process management system for improving productivity and achieving smart factory
- Standard 3D AOI for various manuracturing process
MS-11, 3D In-line SPI
SPI is a advance guard to the quality management: the most effective means of improving production efficiency in the early stages of production
Mirtec’s SPI has secured high precision and repeatability by adopting a leading optical technology, superior than other competitors. Based on this advantage,the SPI can be used for general SMT as well as semiconductor productions as the SPI can detect the very minimal amount of solder paste
for defectives. In addition, Mirtec’s diverse process management sofrware is a very effective way to optimize the process and improve production
efficiency by realizing problem on production and statistically analyzing the problem based on M2M communication with SPI.
Outstanding performance at resonable price
| Brand |
|---|
